SAN FRANCISCO, Aug. 18, 2015/PRNewswire/ — Super Micro Computer, Inc. (NASDAQ: SMCI), a worldwide pioneer in superior, high-effectiveness server, stockpiling innovation and green figuring highlights its end-to-end framework answers for Enterprise, Data Center and Cloud situations this week at Intel Developer Forum (IDF) 2015 at the Moscone Center in San Francisco, California. Supermicro arrangements, for example, their 1U Ultra structural planning 10x NVMe SuperServer, 2U Ultra 24x NVMe SuperServer®, 7U SuperBlade® supporting 42x/30x NVMe, 1U 4x Intel® Xeon Phi™ coprocessor SuperServer with spearheading non-preheat GPU construction modeling, likewise good with forthcoming propelled Intel® media handling card code-named Valley Vista, 3U/6U MicroBlade (MBI-6118D-T4H, MBI-6118D-T2H) with Citrix® virtual desktop demo, 4U 4-Way, 6TB 96x DIMM SuperServer and 4U 90x 3.5″ top-burden hot-swap HDD JBOD will be in plain view in their fundamental stall. Included in the Intel® Network Builders Community will be a demo of the 2U Hyper-Speed Ultra SuperServer® alongside the 48x port 10GbE/6x port 40GbE Cumulus Linux prepared (SSE-X3648SR) progressed SDN switch. A determination of inserted server arrangements and IoT Gateway (SYS-E100-8Q) gadget will be in plain view in the Internet of Things (IoT) Community, and extra 1U 2x NVMe Ultra SuperServer (SYS-1028U-TNRT+), 7U 42x NVMe (SBI-7428R-C3N, SBI-7428R-T3N) SuperBlade® and 30x NVMe (SBI-7128R-C6N) SuperBlade® will be shown in the NVM Express™ (NVMe) Community. Moreover Supermicro will demo its most recent Redfish 1.0 answer for remote frameworks administration in hyper-scale server farms and present points of interest at its Gold Sponsor Session (GSSS002), Tuesday August eighteenth, 2:30pm – Applying Systems Management for Optimized Data Center Architecture.
"Supermicro's innovation authority in Green Computing items, arrangements and administrations address our client's most prominent requests and difficulties in the advancing information driven, data economy," said Charles Liang, President and CEO of Supermicro. "Our 1U Ultra SuperServer supporting 10x hot-swap NVMe drives, 42x/30x NVMe SuperBlade, Intel Xeon processor-based 56 hub MicroBlade in 6U, SDN competent 40GbE switches and information gathering IoT door items are prime cases of the advancements in execution, thickness and effectiveness we accomplish through our designing skill and joint effort with industry accomplices, for example, Intel. With end-to-end propelled innovation stages, worldwide bolster administrations, and extending mix of key open gauges based programming, for example, Redfish and OpenStack, Supermicro is streamlining the way to aggregate framework arrangements."
"The Intel Developer Forum gives a fabulous chance to find out about the most recent advancements from Intel and the business," said Lisa Spelman, general administrator of Data Center Marketing at Intel. "Our wide coordinated effort with Supermicro at IDF is a flawless confirmation of this bleeding edge development with various exhibits of Intel construction modeling construct Supermicro arrangements in light of presentation showcasing cutting edge abilities foor the data center.”
IDF 2015 Product HighlightsMain Booth (#700)
(NEW) 2U Ultra SuperServer® (SYS-2028U-TN24RT+) 24x NVMe - Supports double Intel® Xeon® processor E5-2600 v3, up to 1.5TB ECC, up to DDR4 2133MHz in 24x DIMMs, 2x PCI-E 3.0 x16 openings (FH 10.5″ L), 1x PCI-E 3.0 x8 space (LP), 2x 10GBase-T ports, 24+2 x 2.5″ hot-swap drive narrows, 24x NVMe ports (12x NVMe from CPU 1, 12x NVMe from CPU 2 – 4x cross breed ports for discretionary SAS3/SATA3), 2x SATA3 (back IO), 1600W Redundant Power Supplies Titanium Level (96%)
1U Ultra SuperServer® (SYS-1028U-TN10RT+) 10x NVMe - Supports double Intel® Xeon® processor E5-2600 v3, up to 1.5TB ECC, up to DDR4 2133MHz in 24x DIMMs, 3x PCI-E 3.0 x8 openings (2x FH 10.5″ L, 1x LP) 2x 10GBase-T ports,10x 2.5″ hot-swap drive inlets, 6x NVMe ports (NVMe from CPU 1), 4x NVMe/SAS3 mixture ports for discretionary SAS3/SATA3 (NVMe from CPU 2), 1000W Redundant Power Supplies Titanium Level (96%)
1U SuperServer® (SYS-1028GQ-TR/ - TRT) Whitepaper 4x Intel® Xeon Phi™ coprocessor - another high-thickness 4x Intel® Xeon Phi™ coprocessor 1U SuperServer which boosts execution and thickness through spearheading non-preheat coprocessors building design and PCIe direct interface (no augmentation links, re-drivers, or scaffold chips) for most minimal inertness. Additionally good with impending dispatched Intel® media preparing card code-named Valley Vista focusing on applications, for example, high-effectiveness feature coding (HEVC) and propelled feature coding (AVC) in the Cloud.
3U/6U MicroBlade - an effective, adaptable, in with no reservations one aggregate framework highlights industry-driving vitality proficiency and thickness - 0.05U (Atom C2000), 0.1U (Xeon-D), 0.2U (Xeon E5-2600 v3, Xeon E3-1200 v4/v3). The MicroBlade nook can consolidate 1 Chassis Management Module, and up to 2x 25/10/2.5/1GbE SDN switches in 3U or up to 2 Chassis Management Modules, and up to 4 SDN Switches in 6U for proficient, high-data transmission correspondences. It can fuse up to 4 or 8 excess (N+1 or N+N) 2000W/1600W Titanium/Platinum Level high-productivity (96%/95%) force supplies with cooling fans. This imaginative new era building design incorporates servers, systems administration, stockpiling, and bound together remote administration for distributed computing, committed facilitating, web front end, content conveyance, long range informal communication, ventures, and superior registering applications.
MBI-6128R-T2/ - T2X - execution arranged arrangement with most noteworthy thickness up to 196 Intel® Xeon® DP hubs (5488) centers) per 42U rack with 95% link lessening - underpins double Intel® Xeon® Processor E5-2600 v3 (up to 120W, 14 centers) with 1GbE and 10GbE choices. It is ideal for big business and additionally distributed computing applications.
MBI-6218G-T41X, MBI-6118G-T41X - high thickness, low power arrangement highlighting 56/28 Intel® Xeon® Processor D-1500 (Broadwell-DE) based servers in 6U (up to 392 registering hubs for each 42U rack) or 28/14 servers in 3U with 10GbE. It is a financially savvy answer for scale-out cloud workloads.
MBI-6118D-T2H/ - T4H - supporting Intel® Xeon® processor E3-1200 v4 and fourth Gen. Core™ i3 (up to 84W TDP), this UP MicroBlade stands second to none in its class. Elements incorporate Power Efficiency with 14nm innovation, enhanced execution, coherency and offset of CPU and GPU Graphics by means of bundle interconnect shared L3 Cache and 128MB Graphic implanted store. A less complex CPU subset and Intel® Iris™ Pro illustrations P6300 in an interconnect bundle empower key advancements for the best server execution per watt per flop with incredible representation accentuation.
MBI-6118D-T2/ - T4 - high-thickness, single-attachment server arrangement supporting Intel® Xeon® E3-1200 v3 and fourth Gen. Core™ i3 (up to 84W TDP). Up to 196 Denlow UP hubs for each 42U rack and 99% link decrease. Improved for Cloud based Web facilitating, VDI, gaming and virtualized workstations.
MBI-6418A-T7H/ - T5H - ultra low power & financially savvy arrangement utilizing 8-Core Intel® Atom™ Processor C2000, with up to 112 hubs in 6U (up to 784 registering hubs for each 42U rack) walled in area. It is an impeccable answer for such cloud applications as devoted facilitating, Web serving, memory reserving, content conveyance, and so on.
4U 4-Way (SYS-4048B-TRFT/ - TR4FT) - Quad Intel® Xeon® processor E7-8800/4800 v3 (v2 - TRFT) (18-center, 165W TDP) processors, 6TB in 96x DDR3 1600MHz (- TRFT) or DDR4 1866MHz ECC RDIMMs/LRDIMMs, 48x 2.5″ or 24x 3.5″ (SYS-8048B-TRFT/ - TR4FT) hot-swap HDD/SSD coves, and discretionary 8x 8TB PCIe NVMe cards for low inactivity and elite in-memory workloads. Upgraded for expansive scale mission discriminating in-memory processing, virtualization, ERP/CRM, Financial Analysis applications in Enterprise, Data Center, Cloud, and HPC situations.
4U SuperStorage (SC946ED-R2KJBOD) 90x 3.5″ Top-Load, Hot-Swap SAS 3.0 12Gb/s HDD JBOD - Tool-less outline highlights double hot-swappable expander modules for high-accessibility, 4x Mini SAS HD ports per module, and excess 1000W (2+2) Titanium Level high-effectiveness (96%) computerized force supplies
7U SuperBlade® - favorable circumstances incorporate greatest thickness, most extreme execution, least administration expenses, lower force utilization, ideal ROI, higher accessibility, and better adaptability. SuperBlade servers bolster most recent Intel® Xeon® Processor E5-2600 v3 and are accessible in NVMe DataCenter Blade® (SBI-7428R-C3N, SBI-7428R-T3N), TwinBlade® (SBI-7228R-T2F/ - T2F2/ - T2X), Intel® Xeon Phi™ Blade (SBI-7128RG-X/ - F/ - F2), and StorageBlade with NVMe support (SBI-7128R-C6N). 7U walled in area highlights most recent Mellanox® EDR 100Gb/s InfiniBand and FDR 56Gb/s InfiniBand switches, FCoE and 10Gb/s Ethernet switches, repetitive skeleton administration module (CMM) and Titanium Level 3200W and Platinum Level 3000W/2500W (N+N or N+1 excess) power supplies.
Motherboards – Dual (DP) and Single (UP) Processor
Venture class DP supporting Intel® Xeon® processor E5-2600 v3 X10DAi, X10DRG-Q, X10DAC, X10DRX, X10DRL-i, X10DRH-iT, X10DRH-CT, X10DRH-CLN4, X10DAX; UP Intel® Xeon® processor D-1540 X10SDV-TLN4F, Intel® Xeon® processor E5-2600 v3/E51600v3/fourth Gen. Core™ i7 X10SRA
Gaming and Desktop UP supporting Intel® sixth Gen Core™ i7/i5/i3 arrangement processors C7Z170-SQ, Intel® Xeon® processor E5-2600 v3/E51600v3/fourth Gen. Core™ i7 C7X99-OCE
Cutting edge reduced UP/inserted server sheets supporting Intel® Pentium® Processor N3700 (6W) once in the past code-named Braswell X11SBA-LN4F, future Intel® sixth Gen Core™ i7/i5/i3 arrangement processors X11SSQ, X11SSV-Q, X11SSZ-QF and future Intel® Xeon® processor E3-1200 v5 item families, X11SSZ-F/ - TLN4F and X11SSH-LN4F
NVM Express™ (NVMe) Community (#873)
7U 42x/30x NVMe SuperBlade® – (SBI-7428R-C3N) 3x hot-plug NVMe or SAS3, HW RAID 0, 1, 5; (SBI-7428R-T3N) 3x hot-plug NVMe or SATA3, RAID 0, 1, 5, (SBI-7128R-C6N) 6x hot-plug 2.5″ hot-swap drive sounds – 3x NVMe/SAS3 + 3x SAS3, HW RAID 0, 1, 5, 6, 10, 50 with discretionary SuperCap
1U Ultra (SYS-1028U-TNRT+) - Supports double Intel® Xeon® processor E5-2600 v3, up to 1.5TB ECC, up to DDR4 2133MHz in 24x DIMMs, 2x PCI-E 3.0 x16 spaces (FH, 10.5″ L), 2x PCI-E 3.0 x8 openings (LP, 1 inner), 2x 10GBase-T ports, 10x Hot-swap 2.5″ Drive Bays, Default 8x SATA3 ports and 2x NVMe/SATA3 half breed ports, discretionary 8x SAS3 ports through AOC, 750W Redundant Power Supplies Platinum Level (94%+)
Web of Things (IoT) Community (#102)
IOT Gateway (SYS-E100-8Q) - Compact, Ultra Low-Power, Fanless Edge to Cloud Mesh Network Device. Bolsters 2.2W Intel® Quark™ X1021 SoC, 512MB DDR3 ECC memory, 1x Micro SDHC up to 32GB, 2x Mini-PCI-E spaces, 1x ZigBee module attachment, TPM 1.2, 2x 10/100Mbps RJ45, Operating Temperature 0°C to 50°C
1U Short-Depth SuperServer® (SYS-5018D-FN4T) - Space-proficient, smaller inserted server for Cloud/Virtualization/NAS applications in SOHO, Corporate situations. Underpins Intel® Xeon® processor D-1540 (8-Core, 45W), 2x 3.5″ or 4x 2.5″ SATA3 drive bayous; 3.5″ fringe inlet, 2.5″ discretionary 1x PCI-E 3.0 x16 opening, up to 128GB ECC RDIMM DDR4 2133MHz or 64GB ECC/non-ECC UDIMM in 4 attachments, double 10GbE LAN, double port GbE LAN, DOM power connector, 200W Low-commotion power supply w/PFC
Smaller Embedded System for Digital Signage, Indoor Kiosk (SYS-E200-8B) – Supports single Intel® Celeron™ J1900 (4-center, 10W), 1x 2.5″ inward commute narrows, up to 8GB 1333MHz DDR3 Non-ECC SO-DIMM in 2 attachment, 1x Mini-PCIe and 1x mSATA space, 2x SATA 2.0, 4x SATA 3.0 (RAID 0, 1, 10), 2x GbE, 1x HDMI, 1x Display Port, 1x VGA, 1x USB 3.0 and 1x USB 2.0 ports, 1x SATA DOM bolster, 60W DC power connector
Conservative cutting edge installed servers (SYS-5029S-TN2, SYS-1019S-M2, SYS-5019S-M2) - Supports Intel® sixth Gen Core™ i7/i5/i3 arrangement processors for Digital Video Surveillance, Cloud-based NAS, Medical IT, Military and Machine Automation appliances/applications
Intel® Network Builders Community (#152)
2U Hyper-Speed Ultra SuperServer® (SYS-6028UX-TR4) - Dual Intel® Xeon® processor E5-2600 v3, up to 1TB ECC, up to DDR4 2133MHz in16x DIMMs, 3x PCI-E 3.0 x16 opening (FH, 10.5″ L), 3x PCI-E 3.0 x8 spaces (1 in x16 FH 10.5″ L, 1 LP, 1 Internal LP), 4x GbE ports, 12x hot-swap 3.5″ commute coves: SATA3 default, 12x SAS3 select., 4x NVMe pick. by means of AOC, 4x substantial obligation fans w/ideal fan pace control, 1000W Redundant Titanium Level (96%) high-proficiency power supplies.
System Switches - 1U Top-of-Rack Switches in front or opposite wind current arrangements SSE-X3648S/SR Layer 2/3, 48x 10GbE/6x 40GbE ports, SDN skilled; SSE-X3348T/TR Layer 3, 48x 10GbE/4x 40GbE; SSE-X3348S/SR Layer 3 48x 10GbE/6x 40GbE ports; SSE-X24SR Layer 3, 24x 10GbE. Additionally SSE-G48-TG4 Layer 2/3 48x 1GbE/4x 10GbE ports; SSE-G24-TG4 Layer 2/3 24x 1GbE/4x 10GbE ports; SSE-G2252P Layer 2, 52x 1GbE – 48 w/Power-over-Ethernet (PoE)
Server Management Software - Server Management Software: Supermicro Server Manager (SSM) deals with a wide arrangement of Supermicro servers conveyed crosswise over datacenters and empowers remote wellbeing observing, force administration and firmware overhauls with a solitary reassure. SSM through robotization abilities, for example, REST API and CLI quickens arrangement and support of servers from autonomous hubs to Hyperscale groups. SSM is likewise bundled with Supermicro Power Manager (SPM) that can oversee power on heterogeneous server merchant items and Supermicro Update Manager (SUM) that gives solid CLI interfaces to firmware overhauls. Supermicro is a dynamic promoter of Redfish gauges as a component of its endeavors to meet the frameworks administration necessities for hyper-scale Datacenters arrangements. This regularly incorporates extensive server bunches conveyed utilizing work processes directed by DevOps and SysOps. Supermicro will bolster Redfish RESTful APIs over our X10 and later era server product offerings including Ultra, TwinPro™ and different stages with authority firmware discharges.
Visit Supermicro at Intel Developer Conference in San Francisco, CA August eighteenth through the twentieth at Moscone Center West, Booths #700, #873, #102, and #152. For more data on Supermicro's finished scope of elite, high-proficiency Server, Storage and Networking arrangements, visit www.supermicro.com.
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About Super Micro Computer, Inc.
Supermicro® (NASDAQ: SMCI), the main pioneer in superior, high-productivity server innovation is a chief supplier of cutting edge server Building Block Solutions® for Data Center, Cloud Computing, Enterprise IT, Hadoop/Big Data, HPC and Embedded Systems around the world. Supermicro is focused on ensuring the earth through its "We Keep IT Green®" activity and furnishes clients with the most vitality proficient, naturally neighborly arrangements accessible available.
Supermicro, Building Block Solutions and We Keep IT Green are trademarks and/or enlisted trademarks of Super Micro Computer, Inc.
Every other brand, names and trademarks are the property of their individuals.
"Supermicro's innovation authority in Green Computing items, arrangements and administrations address our client's most prominent requests and difficulties in the advancing information driven, data economy," said Charles Liang, President and CEO of Supermicro. "Our 1U Ultra SuperServer supporting 10x hot-swap NVMe drives, 42x/30x NVMe SuperBlade, Intel Xeon processor-based 56 hub MicroBlade in 6U, SDN competent 40GbE switches and information gathering IoT door items are prime cases of the advancements in execution, thickness and effectiveness we accomplish through our designing skill and joint effort with industry accomplices, for example, Intel. With end-to-end propelled innovation stages, worldwide bolster administrations, and extending mix of key open gauges based programming, for example, Redfish and OpenStack, Supermicro is streamlining the way to aggregate framework arrangements."
"The Intel Developer Forum gives a fabulous chance to find out about the most recent advancements from Intel and the business," said Lisa Spelman, general administrator of Data Center Marketing at Intel. "Our wide coordinated effort with Supermicro at IDF is a flawless confirmation of this bleeding edge development with various exhibits of Intel construction modeling construct Supermicro arrangements in light of presentation showcasing cutting edge abilities foor the data center.”
IDF 2015 Product HighlightsMain Booth (#700)
(NEW) 2U Ultra SuperServer® (SYS-2028U-TN24RT+) 24x NVMe - Supports double Intel® Xeon® processor E5-2600 v3, up to 1.5TB ECC, up to DDR4 2133MHz in 24x DIMMs, 2x PCI-E 3.0 x16 openings (FH 10.5″ L), 1x PCI-E 3.0 x8 space (LP), 2x 10GBase-T ports, 24+2 x 2.5″ hot-swap drive narrows, 24x NVMe ports (12x NVMe from CPU 1, 12x NVMe from CPU 2 – 4x cross breed ports for discretionary SAS3/SATA3), 2x SATA3 (back IO), 1600W Redundant Power Supplies Titanium Level (96%)
1U Ultra SuperServer® (SYS-1028U-TN10RT+) 10x NVMe - Supports double Intel® Xeon® processor E5-2600 v3, up to 1.5TB ECC, up to DDR4 2133MHz in 24x DIMMs, 3x PCI-E 3.0 x8 openings (2x FH 10.5″ L, 1x LP) 2x 10GBase-T ports,10x 2.5″ hot-swap drive inlets, 6x NVMe ports (NVMe from CPU 1), 4x NVMe/SAS3 mixture ports for discretionary SAS3/SATA3 (NVMe from CPU 2), 1000W Redundant Power Supplies Titanium Level (96%)
1U SuperServer® (SYS-1028GQ-TR/ - TRT) Whitepaper 4x Intel® Xeon Phi™ coprocessor - another high-thickness 4x Intel® Xeon Phi™ coprocessor 1U SuperServer which boosts execution and thickness through spearheading non-preheat coprocessors building design and PCIe direct interface (no augmentation links, re-drivers, or scaffold chips) for most minimal inertness. Additionally good with impending dispatched Intel® media preparing card code-named Valley Vista focusing on applications, for example, high-effectiveness feature coding (HEVC) and propelled feature coding (AVC) in the Cloud.
3U/6U MicroBlade - an effective, adaptable, in with no reservations one aggregate framework highlights industry-driving vitality proficiency and thickness - 0.05U (Atom C2000), 0.1U (Xeon-D), 0.2U (Xeon E5-2600 v3, Xeon E3-1200 v4/v3). The MicroBlade nook can consolidate 1 Chassis Management Module, and up to 2x 25/10/2.5/1GbE SDN switches in 3U or up to 2 Chassis Management Modules, and up to 4 SDN Switches in 6U for proficient, high-data transmission correspondences. It can fuse up to 4 or 8 excess (N+1 or N+N) 2000W/1600W Titanium/Platinum Level high-productivity (96%/95%) force supplies with cooling fans. This imaginative new era building design incorporates servers, systems administration, stockpiling, and bound together remote administration for distributed computing, committed facilitating, web front end, content conveyance, long range informal communication, ventures, and superior registering applications.
MBI-6128R-T2/ - T2X - execution arranged arrangement with most noteworthy thickness up to 196 Intel® Xeon® DP hubs (5488) centers) per 42U rack with 95% link lessening - underpins double Intel® Xeon® Processor E5-2600 v3 (up to 120W, 14 centers) with 1GbE and 10GbE choices. It is ideal for big business and additionally distributed computing applications.
MBI-6218G-T41X, MBI-6118G-T41X - high thickness, low power arrangement highlighting 56/28 Intel® Xeon® Processor D-1500 (Broadwell-DE) based servers in 6U (up to 392 registering hubs for each 42U rack) or 28/14 servers in 3U with 10GbE. It is a financially savvy answer for scale-out cloud workloads.
MBI-6118D-T2H/ - T4H - supporting Intel® Xeon® processor E3-1200 v4 and fourth Gen. Core™ i3 (up to 84W TDP), this UP MicroBlade stands second to none in its class. Elements incorporate Power Efficiency with 14nm innovation, enhanced execution, coherency and offset of CPU and GPU Graphics by means of bundle interconnect shared L3 Cache and 128MB Graphic implanted store. A less complex CPU subset and Intel® Iris™ Pro illustrations P6300 in an interconnect bundle empower key advancements for the best server execution per watt per flop with incredible representation accentuation.
MBI-6118D-T2/ - T4 - high-thickness, single-attachment server arrangement supporting Intel® Xeon® E3-1200 v3 and fourth Gen. Core™ i3 (up to 84W TDP). Up to 196 Denlow UP hubs for each 42U rack and 99% link decrease. Improved for Cloud based Web facilitating, VDI, gaming and virtualized workstations.
MBI-6418A-T7H/ - T5H - ultra low power & financially savvy arrangement utilizing 8-Core Intel® Atom™ Processor C2000, with up to 112 hubs in 6U (up to 784 registering hubs for each 42U rack) walled in area. It is an impeccable answer for such cloud applications as devoted facilitating, Web serving, memory reserving, content conveyance, and so on.
4U 4-Way (SYS-4048B-TRFT/ - TR4FT) - Quad Intel® Xeon® processor E7-8800/4800 v3 (v2 - TRFT) (18-center, 165W TDP) processors, 6TB in 96x DDR3 1600MHz (- TRFT) or DDR4 1866MHz ECC RDIMMs/LRDIMMs, 48x 2.5″ or 24x 3.5″ (SYS-8048B-TRFT/ - TR4FT) hot-swap HDD/SSD coves, and discretionary 8x 8TB PCIe NVMe cards for low inactivity and elite in-memory workloads. Upgraded for expansive scale mission discriminating in-memory processing, virtualization, ERP/CRM, Financial Analysis applications in Enterprise, Data Center, Cloud, and HPC situations.
4U SuperStorage (SC946ED-R2KJBOD) 90x 3.5″ Top-Load, Hot-Swap SAS 3.0 12Gb/s HDD JBOD - Tool-less outline highlights double hot-swappable expander modules for high-accessibility, 4x Mini SAS HD ports per module, and excess 1000W (2+2) Titanium Level high-effectiveness (96%) computerized force supplies
7U SuperBlade® - favorable circumstances incorporate greatest thickness, most extreme execution, least administration expenses, lower force utilization, ideal ROI, higher accessibility, and better adaptability. SuperBlade servers bolster most recent Intel® Xeon® Processor E5-2600 v3 and are accessible in NVMe DataCenter Blade® (SBI-7428R-C3N, SBI-7428R-T3N), TwinBlade® (SBI-7228R-T2F/ - T2F2/ - T2X), Intel® Xeon Phi™ Blade (SBI-7128RG-X/ - F/ - F2), and StorageBlade with NVMe support (SBI-7128R-C6N). 7U walled in area highlights most recent Mellanox® EDR 100Gb/s InfiniBand and FDR 56Gb/s InfiniBand switches, FCoE and 10Gb/s Ethernet switches, repetitive skeleton administration module (CMM) and Titanium Level 3200W and Platinum Level 3000W/2500W (N+N or N+1 excess) power supplies.
Motherboards – Dual (DP) and Single (UP) Processor
Venture class DP supporting Intel® Xeon® processor E5-2600 v3 X10DAi, X10DRG-Q, X10DAC, X10DRX, X10DRL-i, X10DRH-iT, X10DRH-CT, X10DRH-CLN4, X10DAX; UP Intel® Xeon® processor D-1540 X10SDV-TLN4F, Intel® Xeon® processor E5-2600 v3/E51600v3/fourth Gen. Core™ i7 X10SRA
Gaming and Desktop UP supporting Intel® sixth Gen Core™ i7/i5/i3 arrangement processors C7Z170-SQ, Intel® Xeon® processor E5-2600 v3/E51600v3/fourth Gen. Core™ i7 C7X99-OCE
Cutting edge reduced UP/inserted server sheets supporting Intel® Pentium® Processor N3700 (6W) once in the past code-named Braswell X11SBA-LN4F, future Intel® sixth Gen Core™ i7/i5/i3 arrangement processors X11SSQ, X11SSV-Q, X11SSZ-QF and future Intel® Xeon® processor E3-1200 v5 item families, X11SSZ-F/ - TLN4F and X11SSH-LN4F
NVM Express™ (NVMe) Community (#873)
7U 42x/30x NVMe SuperBlade® – (SBI-7428R-C3N) 3x hot-plug NVMe or SAS3, HW RAID 0, 1, 5; (SBI-7428R-T3N) 3x hot-plug NVMe or SATA3, RAID 0, 1, 5, (SBI-7128R-C6N) 6x hot-plug 2.5″ hot-swap drive sounds – 3x NVMe/SAS3 + 3x SAS3, HW RAID 0, 1, 5, 6, 10, 50 with discretionary SuperCap
1U Ultra (SYS-1028U-TNRT+) - Supports double Intel® Xeon® processor E5-2600 v3, up to 1.5TB ECC, up to DDR4 2133MHz in 24x DIMMs, 2x PCI-E 3.0 x16 spaces (FH, 10.5″ L), 2x PCI-E 3.0 x8 openings (LP, 1 inner), 2x 10GBase-T ports, 10x Hot-swap 2.5″ Drive Bays, Default 8x SATA3 ports and 2x NVMe/SATA3 half breed ports, discretionary 8x SAS3 ports through AOC, 750W Redundant Power Supplies Platinum Level (94%+)
Web of Things (IoT) Community (#102)
IOT Gateway (SYS-E100-8Q) - Compact, Ultra Low-Power, Fanless Edge to Cloud Mesh Network Device. Bolsters 2.2W Intel® Quark™ X1021 SoC, 512MB DDR3 ECC memory, 1x Micro SDHC up to 32GB, 2x Mini-PCI-E spaces, 1x ZigBee module attachment, TPM 1.2, 2x 10/100Mbps RJ45, Operating Temperature 0°C to 50°C
1U Short-Depth SuperServer® (SYS-5018D-FN4T) - Space-proficient, smaller inserted server for Cloud/Virtualization/NAS applications in SOHO, Corporate situations. Underpins Intel® Xeon® processor D-1540 (8-Core, 45W), 2x 3.5″ or 4x 2.5″ SATA3 drive bayous; 3.5″ fringe inlet, 2.5″ discretionary 1x PCI-E 3.0 x16 opening, up to 128GB ECC RDIMM DDR4 2133MHz or 64GB ECC/non-ECC UDIMM in 4 attachments, double 10GbE LAN, double port GbE LAN, DOM power connector, 200W Low-commotion power supply w/PFC
Smaller Embedded System for Digital Signage, Indoor Kiosk (SYS-E200-8B) – Supports single Intel® Celeron™ J1900 (4-center, 10W), 1x 2.5″ inward commute narrows, up to 8GB 1333MHz DDR3 Non-ECC SO-DIMM in 2 attachment, 1x Mini-PCIe and 1x mSATA space, 2x SATA 2.0, 4x SATA 3.0 (RAID 0, 1, 10), 2x GbE, 1x HDMI, 1x Display Port, 1x VGA, 1x USB 3.0 and 1x USB 2.0 ports, 1x SATA DOM bolster, 60W DC power connector
Conservative cutting edge installed servers (SYS-5029S-TN2, SYS-1019S-M2, SYS-5019S-M2) - Supports Intel® sixth Gen Core™ i7/i5/i3 arrangement processors for Digital Video Surveillance, Cloud-based NAS, Medical IT, Military and Machine Automation appliances/applications
Intel® Network Builders Community (#152)
2U Hyper-Speed Ultra SuperServer® (SYS-6028UX-TR4) - Dual Intel® Xeon® processor E5-2600 v3, up to 1TB ECC, up to DDR4 2133MHz in16x DIMMs, 3x PCI-E 3.0 x16 opening (FH, 10.5″ L), 3x PCI-E 3.0 x8 spaces (1 in x16 FH 10.5″ L, 1 LP, 1 Internal LP), 4x GbE ports, 12x hot-swap 3.5″ commute coves: SATA3 default, 12x SAS3 select., 4x NVMe pick. by means of AOC, 4x substantial obligation fans w/ideal fan pace control, 1000W Redundant Titanium Level (96%) high-proficiency power supplies.
System Switches - 1U Top-of-Rack Switches in front or opposite wind current arrangements SSE-X3648S/SR Layer 2/3, 48x 10GbE/6x 40GbE ports, SDN skilled; SSE-X3348T/TR Layer 3, 48x 10GbE/4x 40GbE; SSE-X3348S/SR Layer 3 48x 10GbE/6x 40GbE ports; SSE-X24SR Layer 3, 24x 10GbE. Additionally SSE-G48-TG4 Layer 2/3 48x 1GbE/4x 10GbE ports; SSE-G24-TG4 Layer 2/3 24x 1GbE/4x 10GbE ports; SSE-G2252P Layer 2, 52x 1GbE – 48 w/Power-over-Ethernet (PoE)
Server Management Software - Server Management Software: Supermicro Server Manager (SSM) deals with a wide arrangement of Supermicro servers conveyed crosswise over datacenters and empowers remote wellbeing observing, force administration and firmware overhauls with a solitary reassure. SSM through robotization abilities, for example, REST API and CLI quickens arrangement and support of servers from autonomous hubs to Hyperscale groups. SSM is likewise bundled with Supermicro Power Manager (SPM) that can oversee power on heterogeneous server merchant items and Supermicro Update Manager (SUM) that gives solid CLI interfaces to firmware overhauls. Supermicro is a dynamic promoter of Redfish gauges as a component of its endeavors to meet the frameworks administration necessities for hyper-scale Datacenters arrangements. This regularly incorporates extensive server bunches conveyed utilizing work processes directed by DevOps and SysOps. Supermicro will bolster Redfish RESTful APIs over our X10 and later era server product offerings including Ultra, TwinPro™ and different stages with authority firmware discharges.
Visit Supermicro at Intel Developer Conference in San Francisco, CA August eighteenth through the twentieth at Moscone Center West, Booths #700, #873, #102, and #152. For more data on Supermicro's finished scope of elite, high-proficiency Server, Storage and Networking arrangements, visit www.supermicro.com.
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About Super Micro Computer, Inc.
Supermicro® (NASDAQ: SMCI), the main pioneer in superior, high-productivity server innovation is a chief supplier of cutting edge server Building Block Solutions® for Data Center, Cloud Computing, Enterprise IT, Hadoop/Big Data, HPC and Embedded Systems around the world. Supermicro is focused on ensuring the earth through its "We Keep IT Green®" activity and furnishes clients with the most vitality proficient, naturally neighborly arrangements accessible available.
Supermicro, Building Block Solutions and We Keep IT Green are trademarks and/or enlisted trademarks of Super Micro Computer, Inc.
Every other brand, names and trademarks are the property of their individuals.
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